Integrated power devices

1 January 1982

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 6-10
https://doi.org/10.1109/iedm.1982.190196

Abstract

One of the two main trends in the power integration is the combination of logic functions with high voltage output stages resulting in complex HVIC chips which are mainly used for display driving and telecommunication applications. The other trend is to build high current high voltage structures with integrated additional functions making the power devices better compatible to normal IC's and microcomputers.

Keywords

P-N JUNCTIONS
SPACE CHARGE
LOW VOLTAGE
SWITCHES
THYRISTORS
ELECTRIC BREAKDOWN
INSULATION
ION IMPLANTATION
MOS DEVICES
LOGIC DEVICES

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