Conduction Efficiency and Strength of Electronically Conductive Adhesive Joints
- 1 April 1996
- journal article
- research article
- Published by Taylor & Francis in The Journal of Adhesion
- Vol. 56 (1-4) , 229-246
- https://doi.org/10.1080/00218469608010510
Abstract
Electronically conductive adhesives are being considered as an alternative to solder for interconnection in microelectronics. In order to gain insight regarding electrical and mechanical performance properties of this class of adhesive interconnections, overlap joints were made. Joint resistance and mechanical bond strength were measured before and after environmental stressing.Keywords
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