Tetrahedral bonding in the glassy semiconductor Cu15As34Se51
- 31 October 1986
- journal article
- Published by Elsevier in Materials Letters
- Vol. 4 (11-12) , 481-484
- https://doi.org/10.1016/0167-577x(86)90042-x
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Effect of composition on the structure and electrical properties of As-Se-Cu glassesJournal of Applied Physics, 1983
- Chemical Bonding, Internal Surfaces, and the Topology of Non‐Crystalline SolidsPhysica Status Solidi (b), 1980
- Radial distribution analysis of amorphous Al0.23Te0.77 by X-ray diffractionJournal of Non-Crystalline Solids, 1978
- Migration and Crime: A Trans-Tasman ComparisonAustralian & New Zealand Journal of Criminology, 1977
- Structural studies of glassy CuAs and Cu- alloysPhysical Review B, 1974