Microstructure and Strength of Interface between Sn-Ag Eutectic Solder and Cu

• 1 January 1995
• journal article
• Published by Japan Institute of Metals in Journal of the Japan Institute of Metals and Materials
• Vol. 59  (12) , 1299-1305
• https://doi.org/10.2320/jinstmet1952.59.12_1299

Abstract