Ion bombardment induced phase transformations and inert gas mobility in the semiconductors Ge, Si, and GaAs
- 1 January 1970
- journal article
- research article
- Published by Taylor & Francis in Radiation Effects
- Vol. 3 (1) , 93-105
- https://doi.org/10.1080/00337577008235621
Abstract
The present study contributes some new aspects to the general understanding of the ion implantation behaviour of 3 common semiconductor materials, and of diffusion processes in these materials. Single crystals of Si, Ge, and GaAs were bombarded with Kr- or Xe-ions at energies of 40 or 500 keV and doses between 1011 and 2 × 1016 ions/cm2. Gas release measurements and Rutherford scattering of 1 MeV He+-ions combined with channeling were used to study bombardment damage (amorphization) and inert gas diffusion. At low bombardment doses (1011 ions/cm2) and energy (40 keV), no damage was observed and the gas release was compatible with volume diffusion resembling Group I and VIII behaviour. Hence, the pre-exponential terms, D 0, were low (range 10-5±1 cm2 sec−1) and the activation enthalpies, Δ H, were much lower than those of self-diffusion or of diffusion of Group III and V elements. The Δ H's for gas diffusion followed the relation Δ H = (1.05±0.1) × 10−3 Tm eV with the melting point, Tm , in °K. The mechanism of gas mobility might be the Turnbull dissociative mechanism. Rutherford scattering and channeling data indicated that part of the gas occupied lattice sites. At higher doses, the bombarded layers turned amorphous. Channeling experiments showed a coincidence in temperatures for a gas release process different from the above one of volume diffusion, and recrystallization of the disordered layer to the single crystalline state. Both processes occurred in the temperature range 0.60 to 0.65 Tm . The gas release indicated a (partial) single jump character with implied Δ H's following the relation Δ H = (2.1±0.1) × 10−3 Tm eV. Contrary to previous results on oxides, this new gas release occurred at temperatures near to those or even above those of volume diffusion of the gas. Due to the easy formation of an amorphous layer it was difficult to observe the retarded release (trapping of gas) that has been found in many materials at high gas and damage concentrations. However, in a separate series of experiments with 500 keV Kr-ions, a release retarded with respect to volume diffusion of the gas was observed in Si and Ge.Keywords
This publication has 33 references indexed in Scilit:
- The implantation profiles of 10, 20 and 40 keV 85Kr in gallium arsenideJournal of Materials Science, 1969
- A gas-release study of the annealing of bombardment-induced disorder∗ (studies on bombardment-induced disorder—I)Journal of Physics and Chemistry of Solids, 1969
- Inert gas diffusion and radiation damage in ionic crystals and sinters following ion bombardmentCanadian Journal of Physics, 1968
- Channeling of MeV Projectiles in Tungsten and SiliconPhysical Review B, 1968
- ION IMPLANTATION OF SILICON: I. ATOM LOCATION AND LATTICE DISORDER BY MEANS OF 1.0-MeV HELIUM ION SCATTERINGCanadian Journal of Physics, 1967
- ION-BOMBARDMENT-INDUCED RADIATION DAMAGE IN SOME CERAMICS AND IONIC CRYSTALS: DETERMINED BY ELECTRON DIFFRACTION AND GAS RELEASE MEASUREMENTSCanadian Journal of Physics, 1966
- Radiation damage and xenon release in quartz and fused silica following ion bombardmentPhysica Status Solidi (b), 1966
- Conversion of crystalline germanium to amorphous germanium by ion bombardmentPhilosophical Magazine, 1965
- RANGE OF Xe133 AND Ar41 IONS OF KILOELECTRON VOLT ENERGIES IN ALUMINUMCanadian Journal of Physics, 1963
- Damage to Silicon Produced by Bombardment with Helium IonsJournal of Applied Physics, 1957