Aluminum beam leaded chips, substrates and crossovers: A single metal system
- 1 March 1971
- journal article
- 1970 electronic-materials-conference
- Published by Springer Nature in Metallurgical Transactions
- Vol. 2 (3) , 723-727
- https://doi.org/10.1007/bf02662727
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- A beam-lead substrate package for a six-stage TTL shift registerMicroelectronics Reliability, 1969
- Air-Insulated Beam-Lead Crossovers for Integrated CircuitsBell System Technical Journal, 1968
- Metalization and Bonds - A Review of Failure MechanismsFourth Annual Symposium on the Physics of Failure in Electronics, 1967
- Beam-Lead TechnologyBell System Technical Journal, 1966
- Books ReceivedThe Medical Journal of Australia, 1953
- TRENDS OF LIFEBMJ, 1953