Development of a new low-stress hyperred LED encapsulant
- 1 January 1989
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 12 (3) , 387-392
- https://doi.org/10.1109/33.35486
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
- Low-Stress Resin Encapsulants for Semiconductor DevicesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1985
- Reaction enthalpies during the curing oe epoxy resins with anhydridesThermochimica Acta, 1985
- A Degradation due to Surface Oxidations in GaAIAs Red Light Emitting Diodes and a Prevention of ItJournal of the Electrochemical Society, 1985
- Epoxy resins: Effect of extent of mixing on propertiesJournal of Applied Polymer Science, 1982
- Shrinkage and internal stress during curing of epoxide resinsJournal of Applied Polymer Science, 1981