Gas Cooling Enhancement Technology for Integrated Circuit Chips
- 1 September 1984
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 7 (3) , 286-293
- https://doi.org/10.1109/tchmt.1984.1136357
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Heat Transfer EnhancementPublished by Taylor & Francis ,1999
- A Conduction-Cooled Module for High-Performance LSI DevicesIBM Journal of Research and Development, 1982
- An analysis of the effect of plate thickness on laminar flow and heat transfer in interrupted-plate passagesInternational Journal of Heat and Mass Transfer, 1981
- Geometric Optimization of Controlled Collapse InterconnectionsIBM Journal of Research and Development, 1969
- How Altitude Affects Forced Air Cooling Requirements of Electronic EquipmentPublished by Springer Nature ,1963