Aging of Solder Connections to Ti-Pd-Au Films
- 1 September 1979
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 2 (3) , 279-283
- https://doi.org/10.1109/tchmt.1979.1135466
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Diffusion mechanisms in the Pd/Au thin film system and the correlation of resistivity changes with Auger electron spectroscopy and Rutherford backscattering profilesThin Solid Films, 1976
- Intermetallic formation in gold-aluminum systemsSolid-State Electronics, 1970
- Some aspects of the growth of diffusion layers in binary systemsJournal of Nuclear Materials, 1961