Tensile Deformation Behavior of Sn-Ag-Bi System Lead-free Solders.

• 1 January 1998
• journal article
• Published by Japan Welding Society in QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
• Vol. 16  (1) , 87-92
• https://doi.org/10.2207/qjjws.16.87

Abstract

Keywords

• BEHAVIOR
• TENSILE DEFORMATION
• SN AG
• AG BI
• BI SYSTEM
• LEAD FREE
• FREE SOLDERS