Development of a 68-Pin Multiple In-Line Package

• 1 December 1980
• journal article
• Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
• Vol. 3  (4) , 594-601
• https://doi.org/10.1109/tchmt.1980.1135669

Abstract

Keywords

• ADAPTER
• CHIP CARRIER
• PLASTIC
• LINE PACKAGE
• NATURAL CONVECTIVE
• EPOXY
• CLAD
• COPPER
• SOLDER