Assembly and solder joint reliability of plastic ball grid array with lead-free versus lead-tin interconnect
- 7 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1198-1204
- https://doi.org/10.1109/ectc.2000.853326
Abstract
No abstract availableKeywords
This publication has 0 references indexed in Scilit: