Thick film conductor adhesion testing

• 1 August 1971
• journal article
• Published by Elsevier in Microelectronics Reliability
• Vol. 10  (4) , 269-275
• https://doi.org/10.1016/0026-2714(71)90301-5

Abstract

Keywords

• ADHESION
• SOLDERS
• LEACHING
• THICK
• MEANINGFUL
• TENSILE
• RECOMMENDATIONS
• MEANT
• SHEAR
• PEEL