CBGA package design for C4 PowerPC microprocessor chips: trade-off between substrate routability and performance

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17 December 2002

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

https://doi.org/10.1109/ectc.1994.367646

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Signal propagation characteristics for thin film, glass-ceramic and alumina based MCM
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002