A Four Asic Mcm-c, the "Kiss" Principle, and the Next Generation Silicon
- 25 August 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
A ceramic MCM was designed and put into volume production. Four identical 15MM per side ASIC devices with 370 bond pads each are wirebonded into a four cavity, cofired, alumina PGA with 383 pins. All materials and processes were selected following the "KISS' (Keep It Super Simple) principle in order to minimize risk and. insure meeting schedule requirements. The results are smaller size, better electrical performance and lower cost than four single chip CPGAs.Keywords
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