A flip chip bonding technology using gold pillars for millimeter-wave applications
- 22 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 2 (0149645X) , 731-734
- https://doi.org/10.1109/mwsym.1997.602894
Abstract
This paper reports a flip chip bonding technology for a millimeter-wave monolithic integrated circuit (MIMIC) using gold micropillars with a controlled air gap instead of conventional wire bonding. We focus on their electrical performance in the W-band and their reliability against stresses expected in automotive radar applications.Keywords
This publication has 3 references indexed in Scilit:
- Comparison of flip chip and wire bond interconnections and the technology evaluation on 51 GHz transceiver modulesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1996
- Millimeter-wave performance of chip interconnections using wire bonding and flip chipPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1996
- Commercial applications of millimeterwaves: history, present status, and future trendsIEEE Transactions on Microwave Theory and Techniques, 1995