Effect of sputtering-cleaning on adhesion of the metallic films to polymer substrates
- 1 July 1998
- journal article
- Published by Elsevier in Materials Chemistry and Physics
- Vol. 54 (1-3) , 102-105
- https://doi.org/10.1016/s0254-0584(98)00094-7
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Scaleup of a nitrogen glow-discharge process for silver–poly(ethylene terephthalate) adhesionJournal of Vacuum Science & Technology A, 1996
- Adhesion studies of metals on fluorocarbon polymer filmsJournal of Vacuum Science & Technology A, 1990
- Enhanced Cu-Teflon adhesion by presputtering prior to the Cu depositionApplied Physics Letters, 1987
- Adhesion of evaporated titanium films to ion-bombarded polyethyleneJournal of Applied Physics, 1986
- Enhanced adhesion from high energy ion irradiationThin Solid Films, 1983
- Metal-polymer interfaces: Adhesion and x-ray photoemission studiesJournal of Applied Physics, 1981