Trend of BGACSPKGD. The Reliability for .MU.BGA.

• 1 January 1998
• journal article
• Published by Japan Institute of Electronics Packaging in Journal of The Japan Institute of Electronics Packaging
• Vol. 1  (5) , 387-391
• https://doi.org/10.5104/jiep.1.387

Abstract

Keywords

• RELIABILITY
• MU.BGA
• TREND OF BGACSPKGD