Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-free Solders
- 1 January 2002
- journal article
- Published by Japan Institute of Metals in MATERIALS TRANSACTIONS
- Vol. 43 (8) , 1854-1857
- https://doi.org/10.2320/matertrans.43.1854
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
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- Thermodynamic Analysis of the Sn-Ag-Bi Ternary Phase DiagramMATERIALS TRANSACTIONS, 2001
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