Mechanical Characteristics of In and Pb5Sn Solders in a Thinfilm Multichip Package

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Abstract
The mechanical properties of the solder joints, in a thin film multichip module, were evaluated using constant deformation-rate, creep and load-relaxation tests in shear mode on specially fabricated samples which are representative of the multichip configuration. While majority of the testing was performed at ambient temperature, a limited amount of study was made to characterize the temperature dependence of the deformation characteristics. Constitutive equations were developed for predicting the deformation behaviors of the solder joints under varied test conditions as well as the in-service reliability of these joints.

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