Measurement of IC Molding Compound Adhesion Strength and Prediction of Interface Delamination Within Package.
- 1 January 1994
- journal article
- Published by Japan Society of Mechanical Engineers in TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
- Vol. 60 (577) , 1992-1999
- https://doi.org/10.1299/kikaia.60.1992
Abstract
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