Future manufacturing techniques for stacked MCM interconnections
- 1 June 1994
- journal article
- Published by Springer Nature in JOM
- Vol. 46 (6) , 51-55
- https://doi.org/10.1007/bf03220722
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Silicon-on-silicon technology for CMOS-based computer systemsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- An overlay interconnect technology for 1 GHz and above MCMsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- High-density, array, optical interconnects for multi-chip modulesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003