Spiral and solenoidal inductor structures on silicon using Cu-damascene interconnects
- 27 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Multilevel-spiral inductors using VLSI interconnect technologyIEEE Electron Device Letters, 1996
- A new toroidal-meander type integrated inductor with a multilevel meander magnetic coreIEEE Transactions on Magnetics, 1994