Three-dimensional masterslice MMIC on Si substrate
- 22 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 113-116
- https://doi.org/10.1109/rfic.1997.598755
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Three-dimensional MMIC technology for multifunction integration and its possible application to masterslice MMICPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Highly integrated three-dimensional MMIC single-chip receiver and transmitterIEEE Transactions on Microwave Theory and Techniques, 1996
- Three-dimensional passive circuit technology for ultra-compact MMICsIEEE Transactions on Microwave Theory and Techniques, 1995
- 0.5-/spl mu/m bipolar technology using a new base formation method: SST1CPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1993