Characterization of copper/enamel interfacial reactions during aging

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Abstract
The interfacial reactions occurring between copper surfaces and a polyesterimide enamel coating during aging at 200°C have been investigated using XPS, AES and SEM. For coating thicknesses of 0.1 μm or greater, a copper oxide layer grows on the copper surface beneath the coating as a result of a reaction with oxygen from the atmosphere. In addition, copper becomes detectable with aging at the air/polyesterimide interface and in the bulk of the coating by surface analysis methods, indicating formation of a mobile copper species. Changes in the XPS line components indicate changes in the polyesterimide structure have occurred. Samples with very thin coatings (c. 100 Å) were also prepared and aged in an attempt to create an interface with dimensions approaching the XPS sampling depth. Upon aging, however, copper oxide grew on top of the original coating, rather than beneath it as in the case of the thicker coatings.

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