Titanium nitride films for barrier applications produced by rapid thermal CVD and subsequent in-situ annealing
- 1 December 1995
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 270 (1-2) , 621-626
- https://doi.org/10.1016/0040-6090(95)06898-8
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Manufacturing aspects of low pressure chemical-vapor-deposited TiN barrier layersThin Solid Films, 1993
- Properties of chemical-vapor-deposited titanium nitrideThin Solid Films, 1993
- Relationship Between the Process Parameters and Film Properties of “Low Temperature” Low Pressure Chemical Vapor Deposition Titanium Nitride FilmsJournal of the Electrochemical Society, 1992
- Diffusion barrier properties of Ti/TiN investigated by transmission electron microscopyJournal of Applied Physics, 1990