Recrystallisation of CVD poly-Si on insulator by dual electron-beam processing
- 18 February 1982
- journal article
- Published by Institution of Engineering and Technology (IET) in Electronics Letters
- Vol. 18 (4) , 163-164
- https://doi.org/10.1049/el:19820112
Abstract
Large areas of 〈100〉 oriented single-crystal films have been produced, using the lateral seeding technique, from polycrystalline silicon deposited on SiO2. One electron beam was used to provide generalised substrate heating, and another swept a localised molten zone in the deposited silicon.Keywords
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