Thermoelectric micro modules for spot cooling of high density heat sources
- 13 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- No. 10942734,p. 391-396
- https://doi.org/10.1109/ict.2001.979914
Abstract
The paper represents further progress in the development of short-legged thermoelectric (TE) micro modules for cooling high power density electronic components. Theoretical analysis and experimental study are conducted to define an available temperature lowering and maximum heat flux densities for short-legged coolers with different kinds of substrates. Temperature differences exceeding 70 K are obtained with TE leg lengths down to 0.2 mm. A new series of micro modules with TE legs 0.2 and 0.3 mm long is developed with an aluminum nitride ceramic.Keywords
This publication has 6 references indexed in Scilit:
- Thick-film thermoelectric microdevicesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Thermoelectric coolers with small response timePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Thermoelectric microcoolers for thermal management applicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Novel high performance thermoelectric microcoolers with diamond substratesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Thermoelectric devices and diamond films for temperature control of high density electronic circuitsAIP Conference Proceedings, 1994
- Miniature thermoelectric coolers for semiconductor lasersAIP Conference Proceedings, 1994