Expansion of Utilizing Temperature Range of Bi2Te3/PbTe by FGM Forming

• 1 May 1999
• journal article
• Published by Trans Tech Publications, Ltd. in Materials Science Forum
• Vol. 308-311, 693-698
• https://doi.org/10.4028/www.scientific.net/msf.308-311.693

Abstract

Keywords

• FLUX
• POWER FACTOR
• SOLDERING
• THERMAL STABILITY
• THERMOELECTROMOTIVE FORCE