Reaction Kinetics, Stress And Microstructure In Titanium-Copper-Titanium Thin Films
- 1 January 1985
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Intermetallic compound formations in titanium-copper thin-film couplesJournal of Applied Physics, 1985
- Intrinsic Stress in Evaporated Metal FilmsJournal of the Electrochemical Society, 1968