Abstract
Pulsed laser ablation of poly(ethylene terephthalate), polyimide, and polyethersulfone films has been investigated by surface potential analysis on the ablated films. After irradiation with XeCl or KrF excimer laser in air, the surface potential of these films changed to a positive potential mainly due to the redeposition of cationic fragments onto the ablated area. On the basis of the potential analysis, the electroless plating (chemical plating) of copper or nickel was carried out selectively on the ablated surface of these films, through a surface activation process using a negatively charged colloid.
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