Electrical Modeling of Interconnections in Multilayer Packaging Structures
- 1 June 1987
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 10 (2) , 217-223
- https://doi.org/10.1109/tchmt.1987.1134722
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Transmission-Line Properties of a Strip on a Dielectric Sheet on a PlaneIEEE Transactions on Microwave Theory and Techniques, 1977
- Reflection and crosstalk in logic circuit interconnectionsIEEE Spectrum, 1970
- Calculation of Coefficients of Capacitance of Multiconductor Transmission Lines in the Presence of a Dielectric InterfaceIEEE Transactions on Microwave Theory and Techniques, 1970