Electroless copper plating from an iminodiacetate bath
- 30 November 1976
- journal article
- Published by Elsevier in Surface Technology
- Vol. 4 (6) , 515-520
- https://doi.org/10.1016/0376-4583(76)90045-5
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
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- The Use of Organic Additives to Stabilize and Enhance the Deposition Rate of Electroless Copper PlatingJournal of the Electrochemical Society, 1972
- The Structure of the Complexed Copper Species in Electroless Copper Plating SolutionsJournal of the Electrochemical Society, 1971
- The Nucleation, Growth, and Structure of Electroless Copper DepositsJournal of the Electrochemical Society, 1970
- Effects of Addition AgentsJournal of the Metal Finishing Society of Japan, 1966
- Effects of Fundamental Plating Conditions on the Deposition RateJournal of the Metal Finishing Society of Japan, 1966
- Effects of the Main Conditions of Chemical Copper Plating on Its Local Anode Reaction and Cathode ReactionJournal of the Metal Finishing Society of Japan, 1966
- Electrode Oxidation Reaction of FormaldehydeJournal of the Metal Finishing Society of Japan, 1965