Environmentally Conscious Engineering in Electronics. 1. Properties of Sn-Ag Binary Alloy as Lead Free Solder and Interface Microstructure with Cu.
- 1 January 1996
- journal article
- Published by Japan Institute of Electronics Packaging in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
- Vol. 11 (7) , 506-509
- https://doi.org/10.5104/jiep1995.11.506
Abstract
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