Low-k dielectrics for ULSI multilevel interconnections: thickness-dependent electrical and dielectric properties
- 7 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 286 (1089084X) , 62-65
- https://doi.org/10.1109/elinsl.2000.845437
Abstract
Electrical and dielectric properties of a promising low-dielectric constant (low-k) crystalline polymer thin film are investigated for deep-submicron multilevel interconnection applications. Filmetrics F20, I-V characteristic measurement, fourier transform infrared spectroscopy (FTIR), X-ray diffraction (XRD) are used to characterize the low-k film. The dc dielectric breakdown strength and the dielectric constant are obtained as a function of film thickness, and a model for the film thickness dependent breakdown strength is also discussed.Keywords
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