Recent developments in silicon hybrid multi-chip modules
- 13 January 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 111-117
- https://doi.org/10.1109/emts.1989.68962
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- A series of demonstrators to assess technologies for silicon hybrid multichip modulesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Ultra-reliable packaging for silicon-on-silicon WSIPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003