Power cycling reliability of IGBT power modules

• 22 November 2002
• proceedings article
• Published by Institute of Electrical and Electronics Engineers (IEEE)
• Vol. 2, 1222-1227
• https://doi.org/10.1109/ias.1997.630841

Abstract

Keywords

• DIODES
• SUBSTRATE
• SWITCHES
• TESTING
• FAILURE ANALYSIS
• PULSE WIDTH MODULATION
• LEAD
• SOLDER
• STRESS TESTING