Coin silver as a construction material in low-temperature experiments

• 1 August 1981
• journal article
• Published by Elsevier in Physica B+C
• Vol. 107  (1-3) , 605-606
• https://doi.org/10.1016/0378-4363(81)90605-7

Abstract

Keywords

• THERMAL CONDUCTIVITY
• CREEP
• COIN SILVER
• COPPER
• CONSTRUCTION MATERIAL
• LOW TEMPERATURE EXPERIMENTS