Nonuniform Pressure Device for Bonding Thin Slabs to Substrates

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Abstract
A method employing compliant solid cylinders and spheres as pressure applicators has been developed for use in bonding large-area slabs (e.g. 8″ × 1/4″ × 0.010″ thick) to solid substrates or to other slabs backed temporarily by solid substrates. The compliant body body produces a pressure profile causing the viscous bonding agent (e.g. epoxy resin) to flow toward the edges of the slab. The rate of compression of the cylinder is immaterial to the process; sufficient force may be applied instantly to flatten the cylinder against the entire top surface of the slab without impeding the viscous flow. The pressure gradient depends on the Young's modulus and the radius of the compliant solid body, so proper cylinders and spheres can be procured to cause very viscous bonding agents to flow into very thin layers. Several successful bonds have been made with overall thicknesses of 150 Angstroms except around dirt particles.

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