Critical Component Requirements for Vapor Phase Soldering Leadless Components on Circuit Board Assemblies for Military Electronics
- 1 December 1983
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 6 (4) , 443-454
- https://doi.org/10.1109/tchmt.1983.1136200
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Clad Metal Circuit Board Substrates for Direct Mounting of Ceramic Chip CarriersCircuit World, 1982
- A Rapid Technique of Evaluating Thermally Induced Strains in Leadless Ceramic Chip Carriers Mounted to Polymeric Substrates8th Reliability Physics Symposium, 1982
- Testing of Properties for Soldered Leadless Chip Carrier AssembliesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1981