Filling dual damascene interconnect structures with AlCu and Cu using ionized magnetron deposition
- 1 January 1995
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
- Vol. 13 (1) , 125-129
- https://doi.org/10.1116/1.588004
Abstract
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