Linear finite element stress simulation of solder joints on 225 I/O plastic BGA package under thermal cycling
- 19 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 930-936
- https://doi.org/10.1109/ectc.1995.517802
Abstract
Linear steady state finite element models have been performed to simulate thermally induced stresses on 225 I/O plastic ball grid array (PBGA) packages under thermal cycling (TC) condition. Eutectic solder joints (63%Sn, 37%Pb) in shapes of barrel and hourglass have been studied. The effects of thermally induced stresses on the solder joints between BT (Bismaleimide Triazine) substrate of PBGA and FR-4 print circuit board (PCB) are studied as a function of four parameters: (a) coefficient of thermal expansion (CTE) of molding compound, (b) height of solder joint, (c) size of solder pad, and (d) location of silicon chip. Furthermore, the warpages of a PBGA substrate caused by transfer molding and solder reflow processes are discussed. Several PBGA designs with minimum thermal stress are proposed based on the above finite element analysis results.Keywords
This publication has 5 references indexed in Scilit:
- Effects of Ceramic Ball-Grid-Array Package's Manufacturing Variations on Solder Joint ReliabilityPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- Effects of die coatings, mold compounds and test conditions on temperature cycling failuresPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Low-cost ceramic thin-film ball grid arraysPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- A study of the interactions of molding compound and die attach adhesive, with regards to package crackingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Solder Joint ReliabilityPublished by Springer Nature ,1991