Low dielectric material for multilayer printed wiring boards

Publisher Website

4 December 2002

proceedings article
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 196-205
https://doi.org/10.1109/iemt8.1990.171104

Abstract

No abstract available

Keywords

This publication has 2 references indexed in Scilit:

The Curing Reaction and Glass Transition Temperature of Maleimide Resin Containing Epoxy Groups
Polymer Journal, 1988
Thermal degradation of poly(bismaleimides)
Journal of Polymer Science: Polymer Chemistry Edition, 1976