The effect of the polishing pad treatments on the chemical-mechanical polishing of SiO2 films
- 1 December 1995
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 270 (1-2) , 601-606
- https://doi.org/10.1016/0040-6090(96)80082-4
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Chemical‐Mechanical Polishing for Fabricating Patterned W Metal Features as Chip InterconnectsJournal of the Electrochemical Society, 1991
- Application of Chemical Mechanical Polishing to the Fabrication of VLSI Circuit InterconnectionsJournal of the Electrochemical Society, 1991