Thermal analysis of a substrate with power dissipation in the vias
- 2 January 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Temperature distribution in a plate with temperature-dependent thermal conductivity and internal heat generationInternational Journal of Heat and Mass Transfer, 1989
- Convection Heat Transfer in Electronic Equipment CoolingJournal of Heat Transfer, 1988
- Temperature field of a plate with internal temperature-dependent heat sourceJournal of Engineering Physics and Thermophysics, 1981