Low temperature relaxation of DGEBA epoxy resins: A thermally stimulated discharge current (TSDC) study

Abstract
The effect of curing conditions on the low temperature relaxation behavior of catalyst‐cured epoxy systems based on digliycidyl ether of bisphenol A (DGEBA) has been characterized by the thermally stimulated discharge current (TSDC) technique. In these chemically relatively simple epoxy systems, five relaxation processes, designated as γ, β, β′, βOH, and β″, have been observed: Their molecular origins are discussed in detail. The results are in agreement with prior suggestions of an inhomogeneous cross‐link density morphology.

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