RF/microwave characterization of multilayer ceramic-based MCM technology

This publication has 9 references indexed in Scilit:

• Development of three dimensional ceramic-based MCM inductors for hybrid RF/microwave applications
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2003
• High frequency electrical characterization of electronic packaging materials: environmental and process considerations
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• Design of embedded passive components in Low-Temperature Cofired Ceramic on Metal (LTCC-M) technology
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• Investigations of multi-layer ceramic-based MCM technology
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• Design and performance of UHF band inductors, capacitors and resonators using LTCC technology for mobile communication systems
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• Characterization of a planar spiral inductor on a composite-resin low-impedance substrate and its application to microwave circuits
  IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1998
• A multiline method of network analyzer calibration
  IEEE Transactions on Microwave Theory and Techniques, 1991
• Overview of quasi-planar transmission lines
  IEEE Transactions on Microwave Theory and Techniques, 1989
• Choosing Line Lengths for Calibrating Network Analyzers
  IEEE Transactions on Microwave Theory and Techniques, 1983