Abstract
Early in the 1990s in the United States, a series of legislative measures were proposed for banning the use of lead for many applications in industries involving electronic solders. Although electronic solders were ultimately exempted, this argument ignited worldwide concern, and research began on the development of lead-free solders. The U.S. project, organized by the National Center for Manufacturing Sciences (NCMS), was carried out from 1992 to 1996. Major electronics companies and auto manufacturers participated with several national institutes in this project.

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