The Effect of Thin Film Deposition Angle andSubstrate Surface Roughness on Film Dissolution in Molten 60% Sn–40% Pb Solder
Open Access
- 1 January 1977
- journal article
- research article
- Published by Wiley in Active and Passive Electronic Components
- Vol. 4 (1) , 43-46
- https://doi.org/10.1155/apec.4.43
Abstract
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