Laser process for personalization and repair of multichip modules
- 1 December 1991
- proceedings article
- Published by SPIE-Intl Soc Optical Eng
- Vol. 1598, 132-140
- https://doi.org/10.1117/12.51034
Abstract
A process for fast personalization of multi-chip modules has been developed. Multilayer substrates with an incomplete top layer are prefabricated. Substrates are personalized within a few hours, using a frequency doubled Nd:YAG laser. 50 ns pulses with a pulse energy of 0.3 mJ are used for cutting. The same laser is also used for the direct writing of spot links, by decomposition of copper formate films with pulses of only 0.2 (mu) J at a repetition rate of 100 kHz. A detailed description of the applied copper formate technology is presented here.© (1991) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.Keywords
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